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Shin-Etsu X23-7762 Silicone Heat Transfer Compound 1g
Manufacturer: Shin Etsu
Product SKU: ITY-004098
Shin-Etsu X23-7762 Silicone Heat Transfer Compound 1g
POA
Quantity: 

This product is for commercial use only

1g Syringe


Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroS's X23- 7762 thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X23- 7762 to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi's X23-7762 is designed to meet current and future thermal management requirements, thus providing dropin solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.

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IF YOU ARE OUTSIDE OF THE UK, YOU WILL BE REQUIRED TO ORGANISE YOUR OWN SHIPPING ARRANGEMENTS (EX WORKS)
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