Potting and encapsulant systems are used to protect electronic components against a number of different environments such as:
- Thermal shock
- Extreme temperatures
- Chemical attack
- Mechanical shock
The encapsulants can also be used as heat transfer mediums and used on LED applications.
There are a number of materials including polyurethanes, epoxies, silicones and other polymers, each with their own advantages and limitations. There are many factors such as the component design, production methods and the operating conditions that need to be considered prior to application. Therefore, it is very important to understand the chemical and physical properties of each system and carefully match these to your requirements.
Contact our consultants today and our experienced technical consultants can help you choose the the right material to suit your design.