Qty | Ex. VAT |
---|---|
1+ | £20.09 |
Description
<ul>
<li>Used in the rework and repair of printed circuit boards, computers, cell phones or other electronics</li>
<li>Easily remove solder from components or pads on a circuit board</li>
<li>Concentrated fine copper braiding utilises less length of wick for each desoldering application</li>
<li>Made of clean, oxide-free copper wire and tight weave enables quick “on and off” desoldering</li>
<li>Formulated with a flux designed for higher activation temperatures</li>
<li>To be used in conjunction with processes using RMA type no-clean fluxes; conforms to requirements of ANSI/J-STD-004, Type LO</li>
<li>High SIR--conforming to Bellcore specification GR-78-CORE (TR-TSY-000078), and IPC Test Method III</li>
<li><a href=""http://www.descoeurope.com/Contact-Us.aspx"" target=""_blank"">Contact Us</a> for static dissipative bobbins</li>
</ul>
Manufacturer: Desco Europe
MPN: LF-D-25