High-performance phase-change thermal interface materials. When the material reaches its "activation" temperature, it changes state to become a low viscosity material, minimizing the contact thermal resistance and improving the thermal conductivity. Once it cools, it reverts back to its original state.

They offer easy application via screen and stencil printing.

The phase change allows for a vast array of application scenarios while it also has an exceptional thermal conductivity value of between 3.5W/m.K and 5.5W/m.K.