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Description
1g Syringe
Thermal grease, X-23-7921-5, is a Non-Solvent type of thermal interface material developed by Shin-Etsu to meet the current and future thermal management requirements of high-performance microprocessors. Its purpose is to increase heat sink effectiveness, and it is used to fill any air gap between the processor and the heat sink.
Key Properties
• Excellent thermal resistance (TR) and thermal conductivity (TC)
• Easily applied via dispensing, stencil printing, or screen printing methods
• Stable homogeneous mixture for consistent thermal performance
• RoHS and REACH Compliant
• High volume production product from a proven industry leader
• Available worldwide through established supply chain network
Packages
