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Description
1g Syringe
Shrinking die and increasing power demands continue to make the thermal solution a critical part of IC package design. Shin-Etsu MicroSi’s X23- 7762 thermal interface material improves performance by enabling packages to run cooler without sacrificing reliability. The ability of X23- 7762 to dissipate heat enables users to reduce the overall cost of their thermal solution. Shin-Etsu MicroSi’s X23-7762 is designed to meet current and future thermal management requirements, thus providing dropin solutions for new IC packages, without the expense of qualifications. This highly thermal conductive grease has been successfully used on CPUs, GPUs, PLCs and other temperature sensitive components.
Key Properties
A mid-level heat transfer compound which has exceptional thermal properties for most electronic heat sink applications.
- Excellent thermal resistance (TR) and thermal conductivity (TC)
- Low viscosity at the time of application, easily applied via dispensing, stencil printing, or screen printing methods
- Stable homogeneous mixture for consistent thermal performance
- RoHS adn REACH Compliant
- High volume production product from a proven industry leader
Brochures
Manufacturer: Shin-Etsu
MPN: X23-7762
